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  SOLDERABILITY, FINE & GROSS LEAK TEST
 
 

SOLDERABILITY, FINE & GROSS LEAK TEST
SOLDERABILITY, FINE & GROSS LEAK TEST

 

 

Premier Semiconductor provides hermiticity testing (seal, fine and gross leak tests) to determine the effectiveness of sealed packages.

Both fine and gross leak tests are performed on ceramic, glass or metal packages per MIL-STD-883, Method 1014.

SOLDERABILITY, FINE & GROSS LEAK TEST