PREMIER SERVICES
 BGA Reballing & Ball Attach
 IC Counterfeit Detection
 Electrical Test
 Wafer Probe
 Burn-in Services
 Lead Free & Pb Conversion
 IC Programming
 Lead Inspection & Lead Repair
 Tape and Reel Services
 Bake & Dry Pack
 Hot Solder Dip & Restoration
 Solderability, Fine & Gross Leak Test
 Mark and Demark
 IC Recovery From Boards
 Site Map

           
         
 
 

PREMIER Semiconductor Services
Value-add Solutions in Final Manufacturing and Test

Premier Semiconductor Services ( PremierS2 ) provides outsourced value-add final manufacturing and test services, including IC Counterfeit Detection and the Pb Free Conversion for BGA's and other package types. Combining the technical expertise, state-of-the-art equipment, capacity and ISO9001:2008 quality system to provide a cost effective alternative to expensive in-house or cumbersome overseas processing.

 
PS2 NEWS

Detecting counterfeit IC’s in today’s
worldwide market is NOT easy!

Premier Semiconductor Services has the expertise, processes and equipment in place to assist with the difficult task of detecting counterfeit IC’s. Visit us here for additional information.

Premier will be participating in the following upcoming events:

  • America II Quality Symposium:  "Securing your supply Chain"
    Warner Center Marriott Los Angeles CA, October 4, 2011
  • America II Quality Symposium:  "Securing your supply chain"
    Embassy Suites - Silicon Valley  Milpitas CA,  October 6, 2011
  • SMTA International Conference - Electronics Exhibition
    Forth Worth, Texas,   October 16th-18th, 2011
  • MEPTEC "Known Good Die" - Presenting: Dave Loaney
    Bitlmore Hotel, Santa Clara Hotel   November 10th, 2011
  • CALCE / SMTA " Counterfeit Electronic Parts and Electronic Supply Chain Symposium. Garden Grove (Anaheim), CA   December 6-8th, 2011

 

 

Being seen as experts in their field, Premier is frequently asked to speak at conferences and symposiums. Some of the recent presentations are listed below:

  • CALCE Symposium on Part Reprocessing, Tin Whisker Mitigation and Assembly Rework in 2008
  • Counterfeit Electronic Components Avoidance Workshop in 2008.
  • "Pb Conversion of BGA's for High Reliability Product" at Meptec in 2008.
  • "Bridging the Industry Needs" at IEEE CPMT in 2007.
  • "Counterfeit Detection Methods" at CALCE in 2007.
  • "Components for Military and Space" at the European CMSE in 2008.
  • CTI Counterfeit Workshop in 2008.
  • CALCE / SMTA "Avoiding, Detecting & Preventing Electronic Parts" in 2008.