PREMIER SERVICES
BGA Reballing & Ball Attach
Wafer Bumping
IC Counterfeit Detection
Electrical Test
Wafer Probe
Burn-in Services
Lead Free & Pb Conversion
IC Programming
Lead Inspection & Lead Repair
Tape and Reel Services
Bake & Dry Pack
Hot Solder Dip & Restoration
Solderability, Fine & Gross Leak Test
Mark and Demark
IC Recovery From Boards
Site Map
WAFER BUMPING SERVICES
Wafer Bumping Services:
Premier offers wafer bumping services including:
300 mm wafer bump capability
Capable of processing 0.2 mm ball diameter
Pb free & Sn / Pb bump capability
MEMS process development
